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Indrajit Zope

Indrajit is highly experienced SAP Senior Solution Architect having expertise in designing and implementing SAP solutions across multiple industries.
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Reliability and Yield for Die-to-Wafer Hybrid Bonded 8-High Stacks with TSV

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The Impact of Hybrid Bonding on Testing 3D-Stacked Dies

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Reducing Wafer-to-Wafer Bonding Misalignment to Enable sub 150nm Pitch Hybrid Bonding

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Wafer-to-wafer Bonding Overlay: Co-Optimization with Lithography and Hidden Patterns

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Technology of Cleaning and Activation Using Surface Wave Excited Plasma Downstream for Hybrid Bonding

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Hybrid Bonding Symposium: Panel - Enabling Hybrid Bonding Proliferation

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Effect of Cu Microstructures on the Thermal Expansion of SiO2 Structures for 3D IC Heterogeneous Integration

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Sub 100nm Die-to-Wafer Hybrid Bonding Drives Foundry 2.0

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Abrasive-Free Polymer Chemical–Mechanical Polishing for PI/Cu Hybrid Bonding: High-Rate Removal and an Atomistic Mechanism from Neural-Network-Potential Molecular Dynamics

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From Elastic Expansion to Cu Bulge-Out: Mechanisms, Measurements, and Modeling for Sub-Micron Hybrid Bonding

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Challenges and Impact of Surface Properties on Wafer-level Hybrid Bonding Process for Industrial Application

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