Abstract: Dependency of asymmetric etched profiles on open-ratio and pattern-size within the wafer was studied in a magnetic Very High Frequency (VHF) Plasma etching system for high aspect-ratio ...
Abstract: The deep trench (DT) is the key process to form the diode array in the diode-selected Phase Change Random Access Memory (PCRAM). In this work, the DT has been successfully developed with ...
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