Business Wire

Furukawa Electric Begins Mass Producing Stealth Dicing Tape

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
AZoNano

Increasing Wafer Yield with Semiconductor Wafer Stealth Dicing Methods by Intelligent Motion / Laser Control Algorithms and Motion Stages

Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
조선일보

Korea's ITI challenges Japan's DISCO, touts laser dicing for HBM4, glass

As semiconductor technology pushes the limits, "how to cut" has emerged as a key topic in semiconductor packaging, as important as "how to make." Even a circuit diagram drawn precisely with a ...
Semiconductor Engineering

Laser Ablation Dicing Revolutionizes Ultra-Thin Wafer Saws Beyond The Capability Of Blade Dicing

The demand for consistently high electrical performance in the power discrete semiconductor market has driven component developers to continuously enhance ...