Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...
SAN MATEO, Calif. — Stacked-die packaging — in which IC dice are literally stacked one on top of the other, electrically connected and encapsulated — has taken root in the cell-phone handset market as ...
A growing trend among mobile-memory-system developers is to stack dice vertically in a package. Designers use this method to save board space on small pc boards, which increasingly find use in compact ...
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