Measurement results of the array of three-terminal-based electrochemical memory devices, demonstrating excellent characteristics in both cycle and device-to-device scatter, well above the requirements ...

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...

Scientists develop next-generation semiconductor technology for high-efficiency, low-power artificial intelligence. A research team, consisting of Professor Seyoung Kim from the Department of ...

A research team has recently demonstrated that analog hardware using ECRAM devices can maximize the computational performance of artificial intelligence, showcasing its potential for commercialization ...